Download

Package

Please check this website or follow the Project on Researchgate for the updates if needed.

The source code of SudoDEM2D/3D is hosted at a GitHub repository SudoDEM.

The source codes of the third-party libraries are hostd at a GitHub repository 3rdlibs.

The latest compiled packages support Ubuntu 20.04, 22.04 and 24.04:

Latest release included 3rdlibs

The compiled third-party libraries can be downloaded if you do not prefer to compile them again:

3rdlibs

For Ubuntu 18.04 and older:

main program (with third-party libraries included)
- Latest sources and binaries
- Older released versions
third-party libraries:
- binaries for 3D only:
  - 3rdlibs.tar.xz[md5sum: 6f6bf4686d0a752dffba0259d9b50c07]

Note: Binaries were compiled just for Ubuntu 14 ~ 18. For other Linux distributions, you have to comiple and install from the sources. The compilation and installation without root will be introduced in the quick guide listed below.

Manual

The latest quick guide: Version 1.2.

Examples

Scripts of examples for both 2D and 3D in the subfolder of source code, here

Installation

Read the installation guide in the codes for compiling the sources on your computer.

References

If you plan to publish your research work using this code, please consider citing one of the following publications:

Zhao S., Zhao J. (2021). SudoDEM : Unleashing the predictive power of the discrete element method on simulation for non-spherical granular particles. Computer Physics Communications, 259, 107670. (PDF)
Zhao S., Zhao J. (2019) A poly-superellipsoid-based approach on particle morphology for DEM modeling of granular media. International Journal for Numerical and Analytical Methods in Geomechanics. 43(13): 2147-2169. (PDF)
Zhao S., Evans T. M., Zhou X. (2018). Effects of curvature-related DEM contact model on the macro-and micro-mechanical behaviours of granular soils. Gétechnique, 68(12): 1085–1098. (PDF)
Zhao S., Zhang N., Zhou X., Zhang L. (2017). Particle shape effects on fabric of granular random packing. Powder Technology, 310, 175–186. (PDF)